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Cybersecurity Vehicle Forum: Tokyo, Japan, May 2026
GlobalPlatform held a Cybersecurity Vehicle Forum in Japan on May 26, 2026. It was hosted at NTT’s offices in Tokyo. The PDF presentations from this event are available for download now. A video and additional content will be coming soon.
| Download PDF | Presenter |
| GlobalPlatform Introduction | |
| Root of trust and Chain of Trust | Gil Bernabeu, GlobalPlatform CTO |
| Supply Chain Security: Security Requirement Documents for Connected Components | Hirotaka Yoshida, AIST/CPSEC Group Leader, ICSS-RT Secretary-General |
| AI Cybersecurity in the Automotive Ecosystem | Jorge Wallace Ruiz - DEKRA |
| Cost Benefits in Reusability Reusability of Standardized Hardware Protected Security Environments | Bill Mazzara & Craig Rawlings, Stellantis |
| GP eSE Automotive Framework | Laurent TABARIES, STMicroelectronics |
| Cybersecurity Assurance Levels Supporting ISO/SAE 21434 Objectives | Paul Wooderson, HORIBAMIRA |
| SESIP | Francesca Forestieri, GP Head of Automotive & Jorge Wallace, DEKRA, Chair of Auto SESIP WG |
| SESIP Automotive Roadmap & Profile Development | Jorge Wallace Ruiz, SESIP Technical Automotive WG Chair |
| Panel 1: Security Assurance | |
| HSM Evolution Towards PQC | Dennis Kengo Oka, Global Technical & Cybersecurity Advisor, IAV |
| PQC Road Map | Gil Bernabeu, GlobalPlatform CTO |
| TEE Use Cases Today and Tomorrow | Dr Richard Hayton, Board Member, Chair Automotive Task Force & TES Committee, GlobalPlatform |
| From IDPS-TEE Integration to a Security Platform Specification for SDV | Kimitaka Asaka, Hitachi Solutions Technology, Ltd. |
| SESIP for Procurement | Jorge Wallace Ruiz, GP Chair of SESIP Auto WG |
| Panel 2: Micro-TEEs | |
| Wrap Up | |
