TPS 委員會由來自 Qualcomm 的 Jeremy O’Donoghue 擔任主席。 所有加入 GlobalPlatform 的成員均有資格為此小組做出貢獻。
其目的是使來自不同市場部門的服務提供者和應用開發人員能夠更輕鬆地將其產品中安全性元件提供的強大安全技術連結在一起。 透過 GlobalPlatform 的裝置信任架構 (DTA) 實現這一目標。
裝置附帶 NFC 服務管理規範
GlobalPlatform 管理實體規範完善了來自 ETSI 和 NFC 論壇的補充軟體標準的「堆棧」，該堆棧確保多個行動非接觸式服務在裝置內成功共存，並且無論服務提供者選擇的託管環境如何，這些服務都將按預期運行。
本文件定義了一個管理協定，用於對駐留在裝置中任何類型 SE 上的應用進行遠端系統管理。 透過使用此協定，服務提供者可以開發靈活的遠端系統管理平台，可以輕鬆擴展此平台以管理任何 SE 中的相同應用。
除了現有保護機制（例如限制對敏感 API 的存取權限或安全 OS 策略）之外，還使用安全元件存取控制規範。 其旨在防止對 SE 中的資源進行未經授權的存取，並且通常用於防止拒絕服務攻擊（例如，PIN 阻止、非多選小程式的選擇）。
Mr. O’Donoghue currently serves as Director, Engineering at Qualcomm, working within the Secure Systems Group. He is responsible for architecture and development of software focused around secure platforms and NFC. In previous roles at Qualcomm, he was the lead security architect and software lead for an NFC CLF development, and has worked extensively on telephony aspects of both Android and Windows-based mobile systems. Mr. O’Donoghue was also an early participant in developing the GSMA NFC Handset Requirements and Testbook.
Mr. O’Donoghue joined the GlobalPlatform Board of Directors in 2016.
Olivier Van Nieuwenhuyze
GlobalPlatform Secretary / Treasurer
Mr. Van Nieuwenhuyze currently serves as Senior R&D Engineer at STMicroelectronics. Within this role he has software architecture responsibilities for the NFC ecosystem and secure elements.
He joined STMicroelectronics in 2003 and since 1999 Mr. Van Nieuwenhuyze has been active in several smart card projects for banking, transport and near field communication.
Mr. Van Nieuwenhuyze joined the GlobalPlatform Board of Directors in 2017 and was appointed as GlobalPlatform Secretary / Treasurer in 2021.
Principal Security Engineer
Mr. Sovio has been elected as Chair of the Functional APIs Working Group.
He has several years’ industry experience in cryptographic algorithms, PKI, usable security and security protocols. He has extensive knowledge of working with GlobalPlatform Specifications and was involved in the TEE Internal Core API from an early stage. He has vast experience in using TEE and TEE based services in real-world environments.
Principal Security Solutions Architect
Mr. Marisetty has been elected Vice Chair of the TSP Committee.
He has extensive experience driving end-to-end system on chip security solutions from concept to product delivery. In his current role at ARM, Mr. Marisetty focuses on the emerging market segments of automotive, IoT, and embedded. Prior to this he worked at Intel where he led large silicon solution engineering projects.
Mr. Marisetty holds 25 patents, several publications, and is a co-author of the book ‘Beyond BIOS – Developing with UEFI’ and has authored many architecture specifications over the years.
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